Patent Assignment
Reel/Frame 033552/0483
Assignment of Assignor's Interest
Recorded: 2014-08-18
Pages: 2
Assignors
OH, TAC KEUN
Executed: 2014-07-10
KIM, JONG HOON
Executed: 2014-07-10
SON, HO YOUNG
Executed: 2014-07-10
LEE, JEONG HWAN
Executed: 2014-07-10
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, GYEONGGI-DO, ICHEON, 467-734, KOREA, REPUBLIC OF
Covered Property
(1)
Multi Chip Package and Method for Manufacturing the Same