Patent Assignment
Reel/Frame 033561/0656
Assignment of Assignor's Interest
Recorded: 2014-08-19
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2014-08-15
CHEN, MING-FA
Executed: 2014-08-15
LU, WEN-SEN
Executed: 2014-08-15
CHIOU, WEN-CHIH
Executed: 2014-08-15
TSAI, WEN-CHING
Executed: 2014-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
3D Stacked-Chip Package