Patent Assignment
Reel/Frame 033568/0728
Assignment of Assignor's Interest
Recorded: 2014-08-19
Pages: 3
Assignors
KONCHADY, MANOHAR S.
Executed: 2014-08-15
WU, TAO
Executed: 2014-08-15
ROY, MIHIR K.
Executed: 2014-08-15
JEN, WEI-LUN K.
Executed: 2014-08-15
LI, YI
Executed: 2014-08-15
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Dual Side Solder Resist Layers for Coreless Packages and Packages with an Embedded Interconnect Bridge and Their Methods of Fabrication
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.