Patent Assignment
Reel/Frame 033585/0213
Assignment of Assignor's Interest
Recorded: 2014-08-21
Pages: 6
Assignors
LEI, WEI-SHENG
Executed: 2014-06-02
EATON, BRAD
Executed: 2014-06-02
YALAMANCHILI, MADHAVA RAO
Executed: 2014-06-02
SINGH, SARAVJEET
Executed: 2014-06-02
KUMAR, AJAY
Executed: 2014-06-02
HOLDEN, JAMES M.
Executed: 2014-08-15
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Wafer Dicing Using Femtosecond-Based Laser and Plasma Etch