Patent Assignment
Reel/Frame 033586/0663
Assignment of Assignor's Interest
Recorded: 2014-08-21
Pages: 6
Assignors
KIM, WONKEUN
Executed: 2014-06-10
LEE, IN-YOUNG
Executed: 2014-06-10
JEON, CHANG-SEONG
Executed: 2014-06-10
CHO, TAEJE
Executed: 2014-06-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same