Patent Assignment
Reel/Frame 033602/0377
Assignment of Assignor's Interest
Recorded: 2014-08-25
Pages: 2
Assignors
CHEN, YING-JU
Executed: 2014-08-20
CHEN, JIE
Executed: 2014-08-20
CHEN, HSIEN-WEI
Executed: 2014-08-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Ring Structures in Device Die