Patent Assignment
Reel/Frame 033605/0834
Assignment of Assignor's Interest
Recorded: 2014-08-26
Pages: 3
Assignor
LIANG, AI-HUA
Executed: 2013-10-22
Assignee
SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
NO.9 JIANYE EAST ROAD,,ZHONGSHAN TORCH DEVELOPMENT ZONE, ZHONGSHAN, CHINA
Covered Property
(1)
Method for Manufacturing Printed Circuit Board with Shallow Solder Pad
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.