Patent Assignment
Reel/Frame 033606/0081
Assignment of Assignor's Interest
Recorded: 2014-08-26
Pages: 7
Assignors
CHOI, MI-NA
Executed: 2014-05-29
BAE, SERAN
Executed: 2014-06-09
IM, YUNHYEOK
Executed: 2014-06-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Package-On-Package Devices, Methods of Fabricating the Same, and Semiconductor Packages