Patent Assignment
Reel/Frame 033613/0492
Assignment of Assignor's Interest
Recorded: 2014-08-26
Pages: 4
Assignors
CHEN, MENG-TSE
Executed: 2014-08-14
LIN, CHIH-WEI
Executed: 2014-08-14
HUANG, HUI-MIN
Executed: 2014-08-14
CHENG, MING-DA
Executed: 2014-08-14
LIU, CHUNG-SHI
Executed: 2014-08-14
YU, CHEN-HUA
Executed: 2014-08-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Structures for Wafer Level Package and Methods of Forming Same