Patent Assignment
Reel/Frame 033617/0149
Assignment of Assignor's Interest
Recorded: 2014-08-27
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Structure of Dual Damascene Structures Having via Hole and Trench