Patent Assignment
Reel/Frame 033628/0655
Assignment of Assignor's Interest
Recorded: 2014-08-28
Pages: 9
Assignors
CUONG, DAO NGUYEN PHU
Executed: 2014-08-04
FOH, BARTHOLOMEW LIAO CHUNG
Executed: 2014-08-04
DO, BYUNG TAI
Executed: 2014-07-29
KIM, KYUNG MOON
Executed: 2014-07-11
PUNZALAN, JEFFREY DAVID
Executed: 2014-07-29
CHAI, SEUNGYONG
Executed: 2014-07-14
LEE, SOO WON
Executed: 2014-07-27
SZETO, KWOK KEUNG
Executed: 2014-07-29
KIM, KYUNGOE
Executed: 2014-07-14
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Substrate and Method of Manufacture Thereof
Patent:
9,412,624 →
Application:
14/316,090 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.