Patent Assignment
Reel/Frame 033633/0559
Assignment of Assignor's Interest
Recorded: 2014-08-28
Pages: 4
Assignors
YEH, CHING-FU
Executed: 2014-06-30
LEE, HSIANG-HUAN
Executed: 2014-08-15
PENG, CHAO-HSIEN
Executed: 2014-07-02
WU, HSIEN-CHANG
Executed: 2014-06-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Semiconductor Integrated Circuit Fabrication