IP Library Assignment 033639/0188
Patent Assignment
Reel/Frame 033639/0188

Assignment of Assignor's Interest

Recorded: 2014-08-29 Pages: 2
Assignor
OHSUMI, TAKASHI
Executed: 2006-04-20
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN
Covered Property (1)
Semiconductor Wafer, and Semiconductor Device Formed Therefrom
Patent: 8,164,164 →
Application: 12/887,798 →
Publication: US 2011/0006438
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 29, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0221 →
Change of Name Aug 29, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0817 →