Patent Assignment
Reel/Frame 033639/0817
Change of Name
Recorded: 2014-08-29
Pages: 15
Assignor
OKI SEMICONDUCTOR CO., LTD.
Executed: 2011-10-03
Assignee
LAPIS SEMICONDUCTOR CO., LTD.
2-4-8 SHINYOKOHAMA, KOUHOKU-KU, YOKOHAMA, 222-8575, JAPAN
Covered Properties
(37)
Operation Voltage Supply Apparatus and Operation Voltage Supply Method for Semiconductor Device
Semiconductor Memory Device and Manufacturing Method Thereof
Acceleration Sensing Device
Wire Bonding Method
Non-Volatile Semiconductor Storage Device
Semiconductor Device with Its Test Time Reduced and a Test Method Therefor
Semiconductor Device Fabrication Method
Operation Voltage Supply Method for Semiconductor Device
Non-Volatile Semiconductor Memory Device and Method for Manufacturing the Same
Semiconductor Device Including Groove Width Variation Portion for Inspection
Semiconductor Device
Acceleration Sensor Chip Package
Semiconductor Memory Device
Semiconductor Device for Supplying Power Supply Voltage to Semiconductor Device
Semiconductor Device, Semiconductor Package for Use Therein, and Manufacturing Method Thereof
Semiconductor Device with Esd Protection Function and Esd Protection Circuit
Silicon Carbide Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device
Method of Making Semiconductor Device Packaged by Sealing Resin Member
Fabrication Method for Device Structure Having Transparent Dielectric Substrate
Semiconductor Device Having Damascene Interconnection Structure That Prevents Void Formation Between Interconnections Having Transparent Dielectric Substrate
Semiconductor Wafer, and Semiconductor Device Formed Therefrom
Ultraviolet Detecting Device and Manufacturing Method Threof, and Ultraviolet Quantity Measuring Apparatus
Ofdm Receiver and Doppler Frequency Estimating Circuit
Gate Array
Semiconductor Device Fabrication Method Including Formation of Columnar Electrodes Having Protrusion Sections
Semiconductor Device, Semiconductor Element, and Substrate
High Voltage-Resistant Semiconductor Device and Method of Manufacturing High Voltage-Resistant Semiconductor Device
Photodiode
Semiconductor Device Manufacturing Method
Chip Id Applying Method Suitable for Use in Semiconductor Integrated Circuit
Semiconductor Device and Process for Fabricating the Same
Circuit Board with Embedded Component and Method of Manufacturing Same
Semiconductor Device Including Semiconductor Elements Mounted on Base Plate
Semiconductor Wiring Patterns
Double-Faced Electrode Package, and Its Manufacturing Method
Semiconductor Package
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Aug 28, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033630/0186 →
Assignment of Assignor's Interest
Aug 28, 2014
From: SASAKI, TAKAAKI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033630/0596 →
Change of Name
Aug 28, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033630/0752 →
Assignment of Assignor's Interest
Aug 28, 2014
From: WATANABE, KIYONORI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033629/0665 →
Change of Name
Aug 28, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033629/0680 →
Assignment of Assignor's Interest
Aug 28, 2014
From: IKEJIRI, HIDEO; ONISHI, SHINSUKE
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033629/0716 →
Change of Name
Aug 28, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033629/0740 →
Assignment of Assignor's Interest
Aug 28, 2014
From: MIYAZAKI, HIROKAZU; MATSUI, KATSUAKI; HIGUCHI, TSUTOMU
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033629/0775 →
Change of Name
Aug 28, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033629/0781 →
Assignment of Assignor's Interest
Aug 28, 2014
From: YOSHIE, TORU
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033630/0039 →
Change of Name
Aug 28, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033630/0053 →
Assignment of Assignor's Interest
Aug 28, 2014
From: TAKAHASHI, TAKEO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033630/0145 →
Change of Name
Aug 29, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033637/0639 →
Assignment of Assignor's Interest
Aug 29, 2014
From: FUKUDA, YASUHIRO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033637/0697 →
Change of Name
Aug 29, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033637/0721 →
Assignment of Assignor's Interest
Aug 29, 2014
From: MANEKI, JUNYA
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033637/0766 →
Change of Name
Aug 29, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033637/0782 →
Assignment of Assignor's Interest
Aug 29, 2014
From: WATANABE, KIYONORI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033638/0920 →
Change of Name
Aug 29, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033638/0931 →
Assignment of Assignor's Interest
Aug 29, 2014
From: TASAKI, YOSHIHIDE
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033639/0311 →
Change of Name
Aug 29, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0323 →
Assignment of Assignor's Interest
Aug 29, 2014
From: ORITA, TOSHIYUKI; MANEKI, JUNYA
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033639/0399 →
Change of Name
Aug 29, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0420 →
Assignment of Assignor's Interest
Aug 29, 2014
From: OHIE, MITSUYA; NAKAMURA, KYOTARO; HASHIDATE, SHUICHI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033637/0359 →
Change of Name
Aug 29, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033637/0373 →