Semiconductor device including groove width variation portion for inspection
View Patent ↗An accelerator sensor includes a semiconductor substrate having a main front surface and a main rear surface, a first groove portion being formed along a front surface pattern, in the main front surface, a second groove portion being formed along a rear surface pattern, in the main rear surface, a through-hole being formed because of connection between at least parts of the first groove portion and the second groove portion and at least one groove width variation portion being formed in at least one of inner walls of the first groove portion. An offset of the rear surface pattern to the front surface pattern can be inspected easily by existence of the groove width variation portion.
1. An acceleration sensor device comprising:
a substrate having a front surface and a rear surface, the substrate including a weight portion, a frame portion surrounding the weight portion, and a brace portion connecting the frame portion to the weight portion;
at least one sensor element attached to or buried in the brace portion;
a first groove portion having a front surface pattern in the front surface;
a second groove portion having a rear surface pattern in the rear surface, at least parts of said first groove portion and said second groove portion overlapping so that the overlapping parts of the first and second groove portions become through-holes that extend entirely through the substrate; and
at least one groove width variation portion including a concave portion extending into at least one inner wall of said first groove portion at the through-holes, wherein a part of said concave portion of said at least one groove width variation portion does not overlap the second groove portion, and said at least one groove width variation portion includes a stepwise shape in a plane parallel to said first front surface.
2. The acceleration sensor device as recited in claim 1 , wherein said first groove portion includes a plurality of partial grooves and said at least one groove width variation portion includes a plurality of groove width variation portions, each at respective different ones of said partial grooves.
3. The acceleration sensor device as recited in claim 2 , wherein each of said front surface and said rear surface has a rectangular shape, and said partial grooves are, respectively, four rectangular grooves, and said groove width variation portions are respectively positioned at positions respectively corresponding to four sides of said substrate.
4. The acceleration sensor device as recited in claim 1 , wherein a spindle portion is located at a central region of said substrate, and four cantilever portions resiliently support the spindle portion to an edge of the substrate.
5. The acceleration sensor device as recited in claim 3 , wherein a spindle portion is located at a central region of said substrate, and four cantilever portions resiliently support the spindle portion to an edge of the substrate.
6. The acceleration sensor device as recited in claim 1 , wherein said substrate includes a first substrate portion and a second substrate portion that is joined with the first substrate portion, said first groove portion is formed in the first substrate portion, and said second groove portion is formed in the second substrate portion.
7. The acceleration sensor device as recited in claim 1 , wherein said substrate is an SOI substrate.
8. An acceleration sensor device comprising:
a substrate having a front surface and a rear surface, the substrate including a weight portion, a frame portion surrounding the weight portion, and a brace portion connecting the frame portion to the weight portion;
at least one sensor element attached to or buried in the brace portion;
a first groove portion having a front surface pattern in the front surface;
a second groove portion having a rear surface pattern in the rear surface, at least parts of said first groove portion and said second groove portion overlapping so that the overlapping parts of the first and second groove portions become through-holes that extend entirely through the substrate; and
at least one groove width variation portion including a concave portion extending into at least one inner wall of said first groove portion at the through-holes, wherein a part of said concave portion of said at least one groove width variation portion does not overlap the second groove portion, and said first groove portion includes a plurality of partial grooves and said at least one groove width variation portion includes a plurality of groove width variation portions, each at respective different ones of said partial grooves.
9. The acceleration sensor device as recited in claim 8 , wherein each of said front surface and said rear surface has a rectangular shape, and said partial grooves are, respectively, four rectangular grooves, and said groove width variation portions are respectively positioned at positions respectively corresponding to four sides of said substrate.
10. The acceleration sensor device as recited in claim 8 , wherein said substrate includes a first substrate portion and a second substrate portion that is joined with the first substrate portion, said first groove portion is formed in the first substrate portion, and said second groove portion is formed in the second substrate portion.
11. The acceleration sensor device as recited in claim 8 , wherein said substrate is an SOI substrate.
12. An acceleration sensor device comprising:
a substrate having a front surface and a rear surface, the substrate including a weight portion, a frame portion surrounding the weight portion, and a brace portion connecting the frame portion to the weight portion;
at least one sensor element attached to or buried in the brace portion;
a first groove portion having a front surface pattern in the front surface;
a second groove portion having a rear surface pattern in the rear surface, at least parts of said first groove portion and said second groove portion overlapping so that the overlapping parts of the first and second groove portions are through-holes that extend entirely through the substrate; and
at least one groove width variation portion including a concave portion extending into at least one inner wall of said first groove portion at the through-holes, wherein a part of said concave portion of said at least one groove width variation portion does not overlap the second groove portion, and said at least one groove width variation portion includes a convex portion that protrudes from the at least one inner wall into the through-holes.
13. The acceleration sensor device as recited in claim 12 , wherein said substrate includes a first substrate portion and a second substrate portion that is joined with the first substrate portion, said first groove portion is formed in the first substrate portion, and said second groove portion is formed in the second substrate portion.
14. The acceleration sensor device as recited in claim 12 , wherein said substrate is an SOI substrate.