Semiconductor wiring patterns
View Patent ↗A semiconductor device of the invention include a rectangular semiconductor element mounted on a substrate formed with an external input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal. The semiconductor element comprises, a plurality of first electrodes formed along a first edge of a surface thereof, a plurality of second electrodes formed along an edge opposite to the first edge of the surface, a plurality of third electrodes formed in the neighborhood of a functional block, and an internal wiring for connecting the first electrodes and the third electrodes. The substrate comprises, a first wiring pattern for connecting the external input terminal and the first electrodes, a second wiring pattern for connecting the external output terminal and the second electrodes, and a third wiring pattern for connecting the first electrodes and the third electrodes.
1. A semiconductor device having a rectangular semiconductor element mounted on a substrate formed with an eternal input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal, wherein the semiconductor element comprises:
a plurality of first electrodes formed along a first edge of a surface thereof;
a plurality of second electrodes formed along an edge opposite to the first edge of the surface;
a plurality of third electrodes formed in the neighborhood of a functional block; and
an internal wiring for connecting the plurality of first electrodes and the plurality of third electrodes, and
the substrate comprises
a first wiring pattern for connecting the external input terminal and the plurality of first electrodes;
a second wiring pattern for connecting the external output terminal and the plurality of second electrodes; and
a third wiring pattern for connecting the plurality of first electrodes and the plurality of third electrodes,
wherein the plurality of first electrodes include a first power supply electrode and a first ground electrode, a plurality of at least either first power supply electrodes or first ground electrodes being provided, and the first power supply electrode and the first ground electrode are disposed alternately; and
the third wiring pattern connects the plurality of first power supply electrodes or first ground electrodes with the plurality of third electrodes, and the third wiring pattern is disposed to surround a periphery of the functional block.
2. The semiconductor device according to claim 1 , wherein the plurality of first electrodes and the third wiring pattern are disposed on each of left and right sides of the semiconductor element in the longitudinal direction thereof.
3. The semiconductor device according to claim 2 , wherein the third wiring patterns disposed on the left and right sides have a common connection.
4. The semiconductor device according to claim 1 , wherein:
the first edge has an input electrode forming region where the plurality of first electrodes are formed along the first edge adjacent to each other and output electrode forming regions sandwiching the input electrode forming region;
the plurality of second electrodes are formed along the first edge in the output electrode forming regions; and
the plurality of second electrodes are connected to the external output terminal through the second wiring pattern.