Patent Assignment
Reel/Frame 033630/0752
Change of Name
Recorded: 2014-08-28
Pages: 5
Assignor
OKI ELECTRIC INDUSTRY CO., LTD.
Executed: 2008-10-01
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property
(1)
Semiconductor Device, Semiconductor Package for Use Therein, and Manufacturing Method Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 28, 2014
From: SASAKI, TAKAAKI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033630/0596 →
Change of Name
Aug 29, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0817 →
Assignment of Assignor's Interest
Dec 16, 2014
From: LAPIS SEMICONDUCTOR CO., LTD
To: HPLP TECHNOLOGIES INC.
Reel/Frame 034513/0807 →