IP Library › Assignment 034513/0807
Patent Assignment
Reel/Frame 034513/0807

Assignment of Assignor's Interest

Recorded: 2014-12-16 Pages: 5
Assignor
LAPIS SEMICONDUCTOR CO., LTD
Executed: 2014-10-20
Assignee
HPLP TECHNOLOGIES INC.
15090 AVENUE OF SCIENCE, SUITE 103, SAN DIEGO, CALIFORNIA, 92128
Covered Properties (14)
Semiconductor Device and an Information Management System Thereof
Patent: 6,896,186 →
Application: 09/053,040 →
Publication: US 2002/0036235
Semiconductor Package
Patent: 6,175,159 →
Application: 09/062,720 →
Semiconductor Device
Patent: 6,225,694 →
Application: 09/141,751 →
Method of Manufacturing a Semiconductor Package Having Semiconductor Decice Mounted Theron and Elongate Opening Through Which Electodes and Patterns Are Connected
Patent: 6,890,796 →
Application: 09/689,824 →
Semiconductor Device
Patent: 6,538,319 →
Application: 09/777,676 →
Publication: US 2001/0008301
Semiconductor Device, Semiconductor Package for Use Therein, and Manufacturing Method Thereof
Patent: 6,661,099 →
Application: 09/981,891 →
Publication: US 2002/0027272
Semiconductor Device, Semiconductor Package for Use Therein, and Manufacturing Method Thereof
Patent: 7,129,587 →
Application: 10/690,627 →
Publication: US 2004/0082102
Semiconductor Device and an Information Management System Therefor
Patent: 7,137,557 →
Application: 10/743,045 →
Publication: US 2004/0134979
Semiconductor Device and an Information Management System Therefor
Patent: 7,299,973 →
Application: 10/891,100 →
Publication: US 2004/0256463
Semiconductor Device, Semiconductor Package for Use Therein, and Manufacturing Method Thereof
Patent: 7,365,439 →
Application: 11/581,096 →
Publication: US 2007/0045859
Semiconductor Device and an Information Management System Therefor
Patent: 7,832,648 →
Application: 11/861,561 →
Publication: US 2008/0017700
Semiconductor Device and an Information Management System Therefor
Patent: 7,503,479 →
Application: 11/862,287 →
Publication: US 2008/0083996
Semiconductor Device, Semiconductor Package for Use Therein, and Manufacturing Method Thereof
Patent: 7,663,251 →
Application: 12/057,493 →
Publication: US 2008/0230924
Semiconductor Device, Semiconductor Package for Use Therein, and Manufacturing Method Thereof
Patent: 8,018,076 →
Application: 12/685,777 →
Publication: US 2010/0140787
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Assignment of Assignor's Interest Aug 28, 2014
From: SASAKI, TAKAAKI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033630/0596 →
Change of Name Aug 28, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033630/0752 →
Change of Name Aug 29, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0817 →
Change of Name Dec 12, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 034492/0856 →