Semiconductor device and an information management system thereof
View Patent ↗Individual two-dimensional barcodes 30, 91 and 173 are provided for individual chips 31 arrayed on a wafer 50 , individual lead frames 93 to each of which chips 92 are bonded and individual packaged products 171 constituted of resin sealed semiconductor chips based upon chip ID information to enable information management to be implemented separately for individual chips 31 , individual frames 93 and individual chip products 171 . Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.
1. A semiconductor device having at least one semiconductor chip manufactured from a wafer, said semiconductor chip having a two-dimensional code pattern for information management provided directly on a surface of said at least one semiconductor chip by projection and exposure with the pattern representing chip ID information, and said two-dimensional code pattern is comprised of a plurality of square blocks arranged in a matrix in a predetermined two-dimensional region.
2. A semiconductor device according to claim 1 , wherein:
said chip ID information includes chip information inherent to each chip.
3. A semiconductor device according to claim 1 , wherein:
said chip ID information is projected and exposed using a liquid crystal mask that is capable of changing a light transmitting pattern for each exposure.
4. A semiconductor device according to claim 1 , wherein said two-dimensional code pattern is formed on said semiconductor chip by photolithography.
5. A semiconductor device manufactured using a lead frame, the lead frame having a two-dimensional code pattern for information management provided on said lead frame to which semiconductor chips are bonded, the pattern being directly applied to a peripheral surface of the lead frame and representing frame ID information, and said two-dimensional code pattern is comprised of a plurality of square blocks arranged in a grid in a predetermined two-dimensional region.
6. A semiconductor device according to claim 5 , wherein:
said frame ID information is made to correspond to chip ID information provided as a two-dimensional barcode pattern for information management for each chip.
7. A semiconductor device according to claim 5 , wherein:
said frame ID information includes chip positional information corresponding to chips within said frame.
8. A semiconductor device having at least one semiconductor chip sealed by resin, and having a two-dimensional code pattern for information management provided directly on an outer surface of said resin and representing product ID information, and said two-dimensional code pattern is comprised of a plurality of square blocks arranged in a matrix in a predetermined two-dimensional region.
9. A semiconductor device according to claim 8 , wherein:
said product ID information corresponds to chip ID information provided as a two-dimensional barcode pattern for information management for each chip.
10. A semiconductor device according to claim 8 , wherein:
said product ID information corresponds to frame ID information provided as a two-dimensional barcode pattern for information management on a lead frame to which semiconductor chips are bonded.
11. A semiconductor device according to claim 8 , wherein:
said product ID information includes additional information corresponding to individual chips that are resin-sealed.
12. A semiconductor device according to claim 8 , wherein the blocks of two-dimensional code are formed by laser printing directly on the outer surface of the resin.
13. An information management system for semiconductor devices having at least one semiconductor chip that implements management of information related to said semiconductor devices separately for individual semiconductor devices comprising:
a read device that reads chip ID information, said chip ID information is provided directly on a surface of said semiconductor chip by projection and exposure as a two-dimensional barcode pattern for information management for each chip, said two-dimensional barcode pattern is comprised of a plurality of square blocks arranged in a matrix in a predetermined two-dimensional region; and
a management unit that registers said chip ID information thus read and manages individual semiconductor manufacturing processes based upon said chip ID information thus registered.
14. An information management system for semiconductor devices according to claim 13 , wherein:
said chip ID information is made to correspond to mapping data obtained during a probing process.
15. An information management system for semiconductor devices according to claim 13 , wherein:
said chip ID information is projected and exposed using a liquid crystal mask that is capable of changing a light transmitting pattern for each exposure.
16. An information management system for semiconductor devices having semiconductor chip sealed by resin, which system implements management of information related to said semiconductor devices separated for individual semiconductor devices comprising:
a read device that reads product ID information, said product ID information is provided as a two-dimensional code pattern for information management directly on an outer surface of said resin, said two dimensional code pattern is comprised of a plurality of square blocks arranged in a matrix in a predetermined two-dimensional region; and
a management unit that registers said product ID information and manages a product shipping process based upon said product ID information that registered.
17. An information management system for semiconductor devices according to claim 16 , wherein: said product ID information corresponds to chip ID information provided as a two-dimensional barcode pattern for information management for each chip.
18. A semiconductor device according to claim 16 , wherein: said product ID information corresponds to frame ID information provided as a two-dimensional barcode pattern for information management on a lead frame to which semiconductor chips are bonded.
19. An information management system for semiconductor devices according to claim 16 , wherein:
said product ID information that is registered corresponds to manufacturing process history information corresponding to each chip.
20. An information management system for semiconductor devices according to claim 16 , wherein:
said product ID information that is registered corresponds to claim information regarding claims made in the field after product shipment.
21. An information management system for semiconductor device manufactured using a lead frame, which system implements management of information related to said semiconductor devices separated for individual semiconductor devices comprising:
a read device that reads frame ID information, said frame ID information is provided directly on a peripheral surface of said lead frame as a two-dimensional code pattern for information management, said two-dimensional code pattern is comprised of a plurality of square blocks arranged in a matrix in a predetermined two-dimensional region; and
a management unit that registers said frame ID information thus read and manages individual semiconductor manufacturing processes based upon said frame ID information that registered.
22. An information management system for semiconductor devices according to claim 21 , wherein:
said frame ID information corresponds to chip ID information provided as a two-dimensional barcode pattern for information management for each chip.