IP Library Granted Patent US 6,661,099
Granted Patent Utility
US 6,661,099 · Confirmation No. 7987

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE FOR USE THEREIN, AND MANUFACTURING METHOD THEREOF

Inventor: Takaaki Sasaki
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Code Description Pages PDF
2003-11-05 LET. Miscellaneous Incoming Letter 2 View
2003-09-30 IFEE Issue Fee Payment (PTO-85B) 2 View
2003-09-30 LET. Miscellaneous Incoming Letter 5 View
2003-09-30 FOR Foreign Reference 2 View
2003-09-30 FOR Foreign Reference 4 View
2003-09-30 FOR Foreign Reference 2 View
2003-09-30 FRPR Certified Copy of Foreign Priority Application 2 View
2003-08-01 FRPR Certified Copy of Foreign Priority Application 2 View
2003-08-01 LET. Miscellaneous Incoming Letter 3 View
2001-10-19 TRNA Transmittal of New Application 4 View
2001-10-19 A.PE Preliminary Amendment 5 View
2001-10-19 SPEC Specification 25 View
2001-10-19 CLM Claims 4 View
2001-10-19 ABST Abstract 1 View
2001-10-19 DRW Drawings-only black and white line drawings 6 View
2001-10-19 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,661,099
App. No.
09/981,891
Filed
2001-10-19
Granted
2003-12-09
Pub. No.
US20020027272A1
Art Unit
2815
PTA
-90 days