Patent Assignment
Reel/Frame 022299/0368
Change of Name
Recorded: 2009-02-19
Received: 2009-02-24
Pages: 12
Assignor
OKI ELECTRIC INDUSTRY CO., LTD.
Executed: 2008-10-01
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI, TOKYO, JPX, 193-8550, JAPAN
Covered Properties
(44)
Semiconductor Device, Semiconductor Package for Use Therein, and Manufacturing Method Thereof
Application:
12/057,493 →
Semiconductor Device and an Information Management System Therefor
Application:
11/862,287 →
Semiconductor Device and an Information Management System Therefor
Application:
11/861,561 →
Semiconductor Device, Semiconductor Package for Use Therein, and Manufacturing Method Thereof
Application:
11/581,096 →
Package Structure for a Semiconductor Device Incorporating Enhanced Solder Bump Structure
Application:
11/521,554 →
Semiconductor Chip Having Pads with Plural Junctions for Different Assembly Methods
Application:
11/169,734 →
Semiconductor Chip Having Pads with Plural Junctions for Different Assembly Methods
Application:
11/169,726 →
Method of Accessing Matrix Data with Address Translation Circuit That Enables Quick Serial Access in Row or Column Directions
Application:
11/143,860 →
Output Circuit of Semiconductor Memory Device
Application:
90/007,434 →
Semiconductor Device and Method for Production Thereof
Application:
10/956,043 →
Semiconductor Device and an Information Management System Therefor
Application:
10/891,100 →
Semiconductor Device and an Information Management System Therefor
Application:
10/743,045 →
Semiconductor Device, Semiconductor Package for Use Therein, and Manufacturing Method Thereof
Application:
10/690,627 →
Method for Fabricating a Semiconductor Apparatus Including a Sealing Member with Reduced Thermal Stress
Application:
10/689,936 →
Method of Accessing Matrix Data with Address Translation Circuit That Enables Quick Serial Access in Row or Column Directions
Application:
10/668,300 →
Liquid-Crystal Display Driving Circuit and Method
Application:
10/650,796 →
Semiconductor Apparatus and Method for Fabricating the Same
Application:
10/388,407 →
Semiconductor Device in a Recess of a Semiconductor Plate
Application:
10/356,613 →
A Method of Making a Lead-on-Chip Device
Application:
10/341,462 →
Timer Apparatus Which Can Simultaneously Control a Plurality of Timers
Application:
10/322,743 →
Memory Interface Circuit
Application:
10/300,870 →
Compound Semiconductor Device and Method for Controlling Characteristics of the Same
Application:
10/300,848 →
Compound Semiconductor Light Emitting Device and Process for Producing the Same
Application:
10/227,412 →
Method of Measuring Surface Form of Semiconductor Thin Film
Application:
10/218,242 →
Semiconductor Chip Having Pads with Plural Junctions for Different Assembly Methods
Application:
10/175,864 →
Semiconductor Chip Having Pads with Plural Junctions for Different Assembly Methods
Application:
10/175,860 →
Apparatus for preventing rapid temperature variation during wafer processing
Application:
10/135,444 →
Output Circuit, Input Circuit and Input/Output Circuit
Application:
10/125,405 →
Memory Interface Circuit
Application:
10/043,236 →
Semiconductor Chip Having Pads with Plural Junctions for Different Assembly Methods
Application:
10/041,965 →
Semiconductor Device in a Recess of a Semiconductor Plate
Application:
10/006,142 →
Semiconductor Device, Semiconductor Package for Use Therein, and Manufacturing Method Thereof
Application:
09/981,891 →
Method for Manufacturing a Semiconductor Device with a Dual Interlayer Insulator Film of Borophosposilicate Glass to Prevent Diffusion of Phosphorus
Application:
09/938,538 →
Semiconductor Circuit with Address Translation Circuit That Enables Quick Serial Access in Row or Column Directions
Application:
09/933,672 →
Semiconductor Apparatus and Method for Fabricating the Same
Application:
09/920,713 →
Method for Removing Contaminant Compounds Respectively Having Benzene Ring Therein from Surface of Si Layer and Method for Producing Semiconductor Device Including Step for Removing Contaminant Compounds
Application:
09/907,595 →
Method for Production of a Semiconductor Device with Package That Includes an Insulator Frame on a Metal Member
Application:
09/906,745 →
Resin-Sealed Semiconductor Device and Method of Manufacturing the Device
Application:
09/875,258 →
Compound Semiconductor Device and Method for Controlling Characteristics of the Same
Application:
09/873,208 →
Output Circuit with Switching Function
Application:
09/828,800 →
Output Circuit, Input Circuit and Input/Output Circuit
Application:
09/794,052 →
Saw Branching Filter with a Braching Filter Circuit Formed on the Package
Application:
09/785,501 →
Semiconductor Device
Application:
09/777,676 →
Brush scrubbing apparatus
Application:
09/758,214 →