Apparatus for preventing rapid temperature variation during wafer processing
View Patent ↗An apparatus for fabricating a semiconductor device, whereby a semiconductor wafer is thermally treated with a wafer treatment device. The semiconductor wafer is delivered with a conveyer to the wafer treatment device. The temperature of the conveyer is controlled to have an optimum temperature by an arm heater and an arm cooler.
1. An apparatus for fabricating a semiconductor device, comprising:
a wafer heater which heats a semiconductor wafer to a first temperature;
a wafer cooler which cools the semiconductor wafer, which has been heated by the wafer heater, to a second temperature;
first and second conveying arms which deliver the semiconductor wafer;
an arm heater which heats the first conveying arm to have an optimum temperature, between the first and second temperatures;
an arm cooler which cools the second conveying arm to have an optimum temperature; and
an intermediate chamber in which the semiconductor wafer is controlled in temperature at between the first and second temperatures,
wherein the semiconductor wafer is delivered to the intermediate chamber before heat treatment by the wafer heater, and before cooling treatment by the wafer cooler,
wherein the first conveying arm delivers the semiconductor wafer between the intermediate chamber and the wafer heater, and
wherein the second conveying arm delivers the semiconductor wafer to the intermediate chamber, and from the intermediate chamber to the wafer cooler.
2. The apparatus according to claim 1 , wherein
the semiconductor wafer is a compound semiconductor wafer.
3. The apparatus according to claim 1 , wherein
the arm heater comprises a heater coil which is provided in the first conveying arm to produce heat in response to electric current.
4. The apparatus according to claim 3 , further comprising:
a first sensor which detects a temperature of the first conveying arm; and
a controller which controls the temperature of the first conveying arm in response to an output signal from the first sensor.
5. The apparatus according to claim 1 , wherein
the arm cooler comprises a circular path provided in the second conveying arm, cooling liquid running in the circular path.
6. The apparatus according to claim 5 , further comprising:
a second sensor which detects a temperature of the second conveying arm; and
a controller which controls the temperature of the second conveying arm in response to an output signal from the second sensor.