Semiconductor device and an information management system therefor
View Patent ↗Individual two-dimensional barcodes are provided for individual chips arrayed on a wafer, individual lead frames to each of which chips are bonded and individual packaged products constituted of resin sealed semiconductor chips based upon chip ID information, to enable information management to be implemented separately for individual chips, individual frames and individual chip products. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.
1. A semiconductor device comprising:
a semiconductor chip having connecting electrodes;
a plurality of outer terminals, each of which electrically connected to corresponding ones of the electrodes; and
a package fixing the semiconductor chip and the outer terminals, the package having a top surface on which a two-dimensional code pattern and another pattern are marked directly, the another pattern positioned nearer to a center of the top surface than the two-dimensional code pattern.
2. A semiconductor device according to claim 1 , wherein the package includes a resin material.
3. A semiconductor device according to claim 1 , wherein the two-dimensional code pattern includes a plurality of square blocks.
4. A semiconductor device according to claim 1 , wherein the another pattern includes a plurality of characters.
5. A semiconductor device according to claim 4 , wherein the characters indicate to a product name.
6. A semiconductor device according to claim 4 , wherein the top surface of the package has four corner portions and the two-dimensional code pattern is positioned near one of the four corner portions.
7. A semiconductor device according to claim 6 , wherein the characters indicate a product name.
8. A semiconductor device according to claim 1 , wherein the top surface of the package has four corner portions and the two-dimensional code pattern is positioned near one of the four corner portions.
9. A semiconductor device according to claim 1 , wherein the semiconductor chip has a two-dimensional code pattern on a surface thereof.
10. A semiconductor device comprising:
a semiconductor chip having connecting electrodes;
a plurality of outer terminals, each of which electrically connected to corresponding ones of the electrodes; and
a package fixing the semiconductor chip and the outer terminals, the package having a top surface on which a two-dimensional code pattern and another pattern are marked directly, the two-dimensional code pattern positioned farther from a center of the top surface than the another pattern.
11. A semiconductor device according to claim 10 , wherein the another pattern is positioned in an area near to the center of the top surface.
12. A semiconductor device according to claim 11 , wherein the another pattern includes a plurality of characters.
13. A semiconductor device according to claim 12 , wherein the characters indicate a product name.
14. A semiconductor device according to claim 12 , wherein the top surface of the package has four corner portions and the two-dimensional code pattern is positioned near one of the four corner portions.
15. A semiconductor device according to claim 14 , wherein the characters indicate a product name.
16. A semiconductor device according to claim 10 , wherein the two-dimensional code pattern includes a plurality of square blocks.
17. A semiconductor device according to claim 10 , wherein the top surface of the package has four corner portions and the two-dimensional code pattern is positioned near one of the four corner portions.
18. A semiconductor device according to claim 10 , wherein the semiconductor chip has a two-dimensional code pattern on a surface thereof.