IP Library Granted Patent US 6,590,297
Granted Patent Utility
US 6,590,297 · Confirmation No. 3272

SEMICONDUCTOR CHIP HAVING PADS WITH PLURAL JUNCTIONS FOR DIFFERENT ASSEMBLY METHODS

Inventor: Masao Sasaki
⬇ PDF
Code Description Pages PDF
2002-06-21 TRNA Transmittal of New Application 4 View
2002-06-21 A.PE Preliminary Amendment 22 View
2002-06-21 SPEC Specification 18 View
2002-06-21 CLM Claims 3 View
2002-06-21 ABST Abstract 1 View
2002-06-21 DRW Drawings-only black and white line drawings 6 View
2002-06-21 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,590,297
App. No.
10/175,864
Filed
2002-06-21
Granted
2003-07-08
Pub. No.
US20020153619A1
Art Unit
2826
PTA
-19 days