IP Library Granted Patent US 6,555,923
Granted Patent Utility
US 6,555,923 · Confirmation No. 4013

SEMICONDUCTOR CHIP HAVING PADS WITH PLURAL JUNCTIONS FOR DIFFERENT ASSEMBLY METHODS

Inventor: Masao Sasaki
⬇ PDF
Code Description Pages PDF
2007-09-14 COCIN Request for Certificate of Correction 3 View
2007-09-14 WFEE Fee Worksheet (SB06) 2 View
2007-09-14 N417 Electronic Filing System Acknowledgment Receipt 2 View
2007-09-14 COCIN Request for Certificate of Correction 1 View
2007-09-14 C.AD Change of Address 1 View
2007-09-14 N417 Electronic Filing System Acknowledgment Receipt 2 View
2002-01-09 TRNA Transmittal of New Application 4 View
2002-01-09 A.PE Preliminary Amendment 26 View
2002-01-09 SPEC Specification 18 View
2002-01-09 CLM Claims 3 View
2002-01-09 ABST Abstract 1 View
2002-01-09 DRW Drawings-only black and white line drawings 6 View
2002-01-09 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,555,923
App. No.
10/041,965
Filed
2002-01-09
Granted
2003-04-29
Pub. No.
US20020066965A1
Art Unit
2826
PTA
-36 days