Semiconductor device including semiconductor elements mounted on base plate
View Patent ↗A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate—such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.
1. A manufacturing method of a semiconductor device comprising:
preparing a first semiconductor device including a substrate, a first semiconductor element mounted on a main surface of the substrate, a first resin portion which covers the first semiconductor element and a plurality of bumps disposed on a rear surface of the substrate;
preparing a second semiconductor device including a second semiconductor element including a plurality of terminals and a second resin portion which covers the second semiconductor element so that the terminals are exposed;
conducting final functional tests on the first and second semiconductor devices until the first and second semiconductor devices pass the final functional tests; and
after the final functional tests, mounting the second semiconductor device on the first semiconductor device with the rear surface of the substrate facing a surface of the second semiconductor element on which the plurality of terminals are formed.
2. The manufacturing method according to the claim 1 , wherein the surface of the second semiconductor element is only covered with the second resin portion.
3. The manufacturing method according to the claim 1 , wherein the second semiconductor device is mounted on a region of the rear surface of the substrate, the plurality of bumps being not disposed on the region.