IP Library Granted Patent US 7,849,743
Granted Patent B2
US 7,849,743 · App. 12/265,960 · Granted Dec 14, 2010

Acceleration sensing device

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Quick Facts
Patent No.
US 7,849,743
App. No.
12/265,960
Granted
Dec 14, 2010
Kind
B2
Abstract

An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member.

Claims (21)

1. An acceleration sensing device, comprising:

an acceleration sensor chip including a movable sensing member, a frame member having a principal surface and a rear surface opposite to the principal surface wherein the frame member surrounds the movable sensing member, and a supporting member coupled between the movable sensing member and the frame member,

wherein the supporting member includes a detecting element which detects displacement of the movable sensing member;

a supporting frame member disposed on the principal surface of the frame member so as to surround the movable sensing member;

a veiling member disposed on the supporting frame member so as to cover the movable sensing member;

a resin film disposed on the principal surface of the frame member so as to seal the veiling member;

a base substrate disposed on the rear surface of the frame member so as to cover the movable sensing member;

a plurality of internal electrodes disposed at the principal surface of the frame member and electrically connected to the detecting element, wherein the internal electrodes are arranged around the supporting frame member; and

a plurality of external electrodes disposed at the principal surface of the frame member and electrically connected to the internal electrodes.

2. The acceleration sensing device according to claim 1 , wherein the veiling member is a flat member including silicon.

3. The acceleration sensing device according to claim 1 , wherein the detecting element is a piezoresistance element.

4. The acceleration sensing device according to claim 1 , further comprising:

a plurality of conductive post members arranged around the supporting frame member, wherein the conductive post members are electrically connected to the internal electrodes and the external electrodes.

5. The acceleration sensing device according to claim 1 , wherein the veiling member includes a semiconductor element which controls operation of the acceleration sensing device.

6. The acceleration sensing device according to claim 5 , wherein the semiconductor element has a plurality of sensor controlling electrodes thereon, the acceleration sensing device further comprising:

a plurality of bonding wires which couple the sensor controlling electrodes with the internal electrodes, wherein the bonding wires are covered with the resin film.

7. The acceleration sensing device according to claim 1 , wherein a rear surface of the movable sensing member includes a plurality of grooves.

8. The acceleration sensing device according to claim 7 , wherein the grooves are arranged in parallel.

9. The acceleration sensing device according to claim 1 , wherein a rear surface of the movable sensing member includes a plurality of protrusions.

10. The acceleration sensing device according to claim 1 , wherein the base substrate has a projecting portion which faces the movable sensing member.

11. The acceleration sensing device according to claim 10 , wherein the projecting portion has a spherical surface.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 29, 2014
From: NAKAMURA, AKIO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 033637/0611 →
CHANGE OF NAME Recorded Aug 29, 2014
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 033637/0619 →
CHANGE OF NAME Recorded Aug 29, 2014
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 033639/0817 →