Semiconductor device, semiconductor element, and substrate
View Patent ↗A semiconductor device, a semiconductor element, and a substrate are provided, which allow the semiconductor element to be provided with a reduced size when combined. The semiconductor device has a rectangular semiconductor element mounted on a substrate formed with an external input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal. The semiconductor element includes a grayscale voltage generating unit for generating a plurality of grayscale voltages by dividing a reference voltage, a plurality of electrodes for the reference voltage formed in the neighborhood of the grayscale voltage generating unit; and an internal wiring for connecting the grayscale voltage generating unit and the reference voltage electrodes. The substrate includes a wiring pattern for the reference voltage for connecting the external input terminal and the reference voltage electrodes.
1. A semiconductor device having a rectangular semiconductor element mounted on a substrate formed with an external input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal, wherein the semiconductor element comprises:
a functional block including a grayscale voltage generating unit for generating a plurality of grayscale voltages by dividing a reference voltage;
a plurality of first electrodes formed in a neighborhood of the functional block;
a first internal wiring for connecting the functional block and the first electrodes;
a plurality of second electrodes formed along a first edge of the semiconductor element;
a plurality of third electrodes formed along an edge of the semiconductor element that is opposite to the first edge; and
a second internal wiring for connecting the first electrodes and the second electrodes,
wherein the substrate comprises
a first wiring pattern for connecting the external input terminal, the plurality of first electrodes, and the second electrodes wherein a part of the wiring of the first wiring pattern that connects the plurality of first electrodes with the second electrodes is disposed in a mounting region on which the semiconductor element is mounted; and
a second wiring pattern for connecting the external output terminal and the third electrodes.
2. The semiconductor device according to claim 1 , wherein
the grayscale voltage generation unit is formed by series-connecting a plurality of resistors respectively disposed in predetermined positions; and
the internal wiring includes an end connection wiring for connecting the first electrodes and ends of a series connection of the functional block, and an intermediate connection part connection wiring for connecting the first electrodes and an intermediate connection part of the series connection of the functional block.
3. The semiconductor device according to claim 1 , wherein
the wiring of the first wiring pattern between the plurality of first electrodes and the second electrodes includes branch points that branch into a plurality of wirings that connect to the first electrodes, the branch points being disposed in the mounting region on which the semiconductor element is mounted.
4. The semiconductor device according to claim 1 , wherein
the plurality of first electrodes include a first power supply electrode and a first ground electrode;
the plurality of second electrodes include a second power supply electrode and a second ground electrode; and
the functional block includes an output unit at which an operational amplifier is formed.
5. The semiconductor device according to claim 1 , wherein
the semiconductor element further comprises a signal input electrode formed in a neighborhood of the second electrodes and along the first edge;
the substrate further comprises an input signal wiring pattern for connecting the signal input electrode and the external input terminal;
the first wiring pattern and the input signal wiring pattern are disposed in a line;
the input signal wiring pattern is disposed at an outer side of the first wiring pattern;
the signal input electrode is disposed closer to a central part of the first edge than the second electrodes;
the input signal wiring pattern connects to the signal input electrode via an outer side of the second electrodes as viewed from the first edge; and
the part of the wiring of the first wiring pattern between the first electrodes and the second electrodes detours around the input signal wiring pattern and is connected to the first electrodes.
6. The semiconductor device according to claim 1 , wherein
the plurality of second electrodes include a second power supply electrode and a second ground electrode, a plurality of at least either second power supply electrodes or second ground electrodes being provided, and the second power supply electrode and the second ground electrode being disposed alternately; and
the wiring of the first wiring pattern between the first electrodes and the second electrodes connects the plurality of second power supply electrodes or second ground electrodes with the first electrodes, said wiring being disposed to surround the periphery of the functional block.
7. The semiconductor device according to claim 1 , wherein the grayscale voltage generation unit includes a first generation unit for generating a grayscale voltage having a positive polarity using a predetermined potential as a reference, and a second generation unit for generating a grayscale voltage having a negative polarity using the predetermined potential as a reference.
8. The semiconductor device according to claim 1 , wherein the neighborhood of the functional block is defined as an area in which the distance between the first electrodes and the functional block is smaller than the distance between the second electrode and the functional block.