Patent Assignment
Reel/Frame 033640/0682
Assignment of Assignor's Interest
Recorded: 2014-08-29
Pages: 6
Assignors
MORROW, PATRICK
Executed: 2013-04-04
NELSON, DON
Executed: 2013-10-23
WEBB, MILTON C.
Executed: 2013-10-20
JUN, KIMIN
Executed: 2013-04-04
SON, IL-SEOK
Executed: 2013-04-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods of Forming Under Device Interconnect Structures