Patent Assignment
Reel/Frame 033641/0514
Assignment of Assignor's Interest
Recorded: 2014-08-29
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2014-08-25
CHEN, MING-FA
Executed: 2014-08-25
YEH, SUNG-FENG
Executed: 2014-08-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Chip-On-Wafer Package and Method of Forming Same