Patent Assignment
Reel/Frame 033658/0615
Assignment of Assignor's Interest
Recorded: 2014-09-03
Pages: 7
Assignors
CHO, SANG HYUN
Executed: 2014-07-03
KO, HYUNG JONG
Executed: 2014-08-04
PARK, KYUNG SOO
Executed: 2014-07-03
YOO, SEOUNG JAE
Executed: 2014-07-17
KIM, SANG HO
Executed: 2014-07-03
PARK, HO JIN
Executed: 2014-08-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Temperature Sensor Embedded in Processor, Method of Operating the Same, and Devices Including the Same