Patent Assignment
Reel/Frame 033664/0971
Assignment of Assignor's Interest
Recorded: 2014-08-29
Pages: 2
Assignor
KATAOKA, TOYOTAKA
Executed: 2014-08-18
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Semiconductor Device, Manufacturing Method of Semiconductor Device, Semiconductor Wafer, and Electronic Equipment