IP Library › Assignment 033669/0072
Patent Assignment
Reel/Frame 033669/0072

Assignment of Assignor's Interest

Recorded: 2014-09-04 Pages: 5
Assignors
LIN, JYUH-FUH
Executed: 2014-06-26
CHEN, CHENG-HUNG
Executed: 2014-06-26
LIU, PEI-YI
Executed: 2014-06-26
WANG, WEN-CHUAN
Executed: 2014-06-26
LIN, SHY-JAY
Executed: 2014-06-26
LIN, BURN JENG
Executed: 2014-06-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Method of Fabricating an Integrated Circuit with Non-Printable Dummy Features
Patent: 9,594,862 →
Application: 14/310,182 →
Publication: US 2015/0370942