Patent Assignment
Reel/Frame 033669/0336
Assignment of Assignor's Interest
Recorded: 2014-09-04
Pages: 2
Assignors
MORI, YOSHIO
Executed: 2014-08-06
TSUCHIYA, KOHSUKE
Executed: 2014-07-30
ASADA, MAKI
Executed: 2014-08-06
TAKAHASHI, SHUHEI
Executed: 2014-07-28
Assignee
FUJIMI INCORPORATED
1-1, CHIRYO 2-CHOME, NISHIBIWAJIMA-CHO, KIYOSU-SHI, AICHI, 452-8502, JAPAN
Covered Property
(1)
Abrasive Composition and Method for Producing Semiconductor Substrate