IP Library Assignment 033669/0361
Patent Assignment
Reel/Frame 033669/0361

Assignment of Assignor's Interest

Recorded: 2014-09-04 Pages: 4
Assignor
SATO, TAKEO
Executed: 2014-08-05
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus, Semiconductor Device Manufacturing Method, Substrate Processing Method, and Recording Medium
Patent: 9,543,220 →
Application: 14/476,337 →
Publication: US 2014/0370628
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →