IP Library › Assignment 033674/0377
Patent Assignment
Reel/Frame 033674/0377

Assignment of Assignor's Interest

Recorded: 2014-09-05 Pages: 10
Assignors
BAROWSKI, HARRY
Executed: 2014-08-28
KEINERT, JOACHIM
Executed: 2014-08-28
RANGARAJAN, SRIDHAR H.
Executed: 2014-08-27
REN, HAOXING
Executed: 2014-08-28
SAHA, SOURAV
Executed: 2014-08-27
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Integrated Circuit Design Changes Using Through-Silicon Vias
Patent: 9,501,603 →
Application: 14/477,976 →
Publication: US 2016/0070840