Patent Assignment
Reel/Frame 033682/0654
Assignment of Assignor's Interest
Recorded: 2014-09-05
Pages: 4
Assignors
HUANG, LIN-CHIH
Executed: 2014-08-25
TENG, HUNG-AN
Executed: 2014-08-25
CHEN, HSIN-YU
Executed: 2014-08-26
WU, TSANG-JIUH
Executed: 2014-08-26
HSIEH, CHENG-CHIEH
Executed: 2014-08-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Substrateless Integrated Circuit Packages and Methods of Forming Same