Patent Assignment
Reel/Frame 033693/0585
Assignment of Assignor's Interest
Recorded: 2014-09-08
Pages: 4
Assignor
VERTICAL CIRCUITS, INC.
Executed: 2012-10-23
Assignee
VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
1100 LA AVENIDA STREET, BUILDING A, MOUNTAIN VIEW, CALIFORNIA, 94043
Covered Property
(1)
Semiconductor Die Having Fine Pitch Electrical Interconnects
Application:
14/480,373 →
Publication:
US 2015/0056753
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 8, 2014
From: BARRIE, KEITH LAKE; PANGRLE, SUZETTE K.; VILLAVICENCIO, GRANT; LEAL, JEFFREY S.
To: VERTICAL CIRCUITS, INC.
Reel/Frame 033693/0548 →
Assignment of Assignor's Interest
Sep 8, 2014
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 033693/0611 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →