IP Library › Assignment 033693/0859
Patent Assignment
Reel/Frame 033693/0859

Assignment of Assignor's Interest

Recorded: 2014-09-08 Pages: 2
Assignor
XUE, YAN XUN
Executed: 2014-09-08
Assignee
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED
475 OAKMEAD PKWY,, SUNNYVALE, CALIFORNIA, 94085
Covered Property (1)
Wafer Level Chip Scale Package with Exposed Thick Bottom Metal
Patent: 9,224,679 →
Application: 14/480,598 →
Publication: US 2015/0001686