Patent Assignment
Reel/Frame 033713/0773
Assignment of Assignor's Interest
Recorded: 2014-09-10
Pages: 5
Assignors
SHIMODA, KOICHIRO
Executed: 2014-07-28
IIZUKA, YASUHITO
Executed: 2014-07-28
YAMAMOTO, MASAKI
Executed: 2014-07-28
SASAKI, YORO
Executed: 2014-07-28
ADACHI, HIROAKI
Executed: 2014-07-28
KASHIWAGI, SHUJI
Executed: 2014-07-28
Assignee
ASAHI KASEI E-MATERIALS CORPORATION
1-105, KANDA JINBOCHO, CHIYODA-KU, TOKYO, 101-8101, JAPAN
Covered Property
(1)
Resin Composition, Layered Product, Multilayer Printed Wiring Board, Multilayer Flexible Wiring Board and Manufacturing Method of the Same