Patent Assignment
Reel/Frame 033741/0250
Assignment of Assignor's Interest
Recorded: 2014-09-15
Pages: 7
Assignors
LEE, HEE-SEONG
Executed: 2014-08-21
KIM, WOO-JIN
Executed: 2014-08-21
SEONG, NAK HEE
Executed: 2014-08-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
System on Chip, Bus Interface and Method of Operating the Same