Patent Assignment
Reel/Frame 033741/0674
Assignment of Assignor's Interest
Recorded: 2014-09-15
Pages: 4
Assignors
CHAWLA, GAURAV
Executed: 2014-09-02
HEPPNER, JOSHUA D.
Executed: 2014-09-02
KRITHIVASAN, VIJAYKUMAR
Executed: 2014-09-02
GARCIA, MICHAEL
Executed: 2014-09-02
LIU, KUANG C.
Executed: 2014-09-03
SWAMINATHAN, RAJASEKARAN
Executed: 2014-09-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Techniques and Configurations Associated with a Package Load Assembly