IP Library › Assignment 033764/0467
Patent Assignment
Reel/Frame 033764/0467

Change of Name

Recorded: 2014-09-17 Pages: 2
Assignor
ASAT LIMITED
Executed: 2010-03-25
Assignee
UTAC HONG KONG LIMITED
138 TEXACO ROAD, QPL INDUSTRIAL BUILDING, 14TH FLOOR, TSUEN WAN, NEW TERRITORIES, HONG KONG
Covered Property (1)
Ball Grid Array Package with Improved Thermal Characteristics
Patent: 9,449,903 →
Application: 14/108,430 →
Publication: US 2014/0183712
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2014
From: MCLELLAN, NEIL; SZE, MING WANG; TSANG, KWOK CHEUNG; LAM, WING KEUNG
To: ASAT LTD.
Reel/Frame 033759/0458 →
Assignment of Assignor's Interest Feb 23, 2016
From: UTAC HONG KONG LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037880/0534 →
Corrective Assignment to Correct the Add Annex Inadvertently Left Out Original Assignment Document Previously Recorded at Reel: 037880 Frame: 0534. Assignor(S) Hereby Confirms the Assignment. Jul 8, 2016
From: UTAC HONG KONG LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039822/0591 →