Patent Assignment
Reel/Frame 033792/0811
Assignment of Assignor's Interest
Recorded: 2014-09-23
Pages: 4
Assignee
CHIPMOS TECHNOLOGIES INC.
NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Chip Package Structure and Manufacturing Method Thereof