Patent Assignment
Reel/Frame 033799/0197
Assignment of Assignor's Interest
Recorded: 2014-09-23
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Methods of Making Integrated Circuits Including Air Gaps Around Interconnect Structures
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.