Patent Assignment
Reel/Frame 033802/0524
Assignment of Assignor's Interest
Recorded: 2014-09-24
Pages: 16
Assignors
LIN, CHING-LING
Executed: 2014-07-04
HUANG, CHIH-SEN
Executed: 2014-07-04
HUNG, CHING-WEN
Executed: 2014-07-04
WU, JIA-RONG
Executed: 2014-07-04
CHANG, TSUNG-HUNG
Executed: 2014-07-04
LEE, YI-HUI
Executed: 2014-07-04
CHEN, YI-WEI
Executed: 2014-07-04
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device Having a Patterned Metal Layer Embedded in an Interlayer Dielectric Layer