Patent Assignment
Reel/Frame 033804/0370
Assignment of Assignor's Interest
Recorded: 2014-09-24
Pages: 5
Assignee
SAMSUNG SDI CO., LTD.
150-20, GONGSE-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, 446-577, KOREA, REPUBLIC OF
Covered Property
(1)
Hybrid Encapsulation Method for Oled Devices
Application:
62/006,038 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.