Patent Assignment
Reel/Frame 036457/0481
Assignment of Assignor's Interest
Recorded: 2015-08-31
Pages: 3
Assignor
BOESCH, DAMIEN
Executed: 2015-05-29
Assignee
SAMSUNG SDI CO., LTD.
150-20, GONGSE-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, 17084, KOREA, REPUBLIC OF
Covered Properties
(2)
Direct/Laminate Hybrid Encapsulation and Method of Hybrid Encapsulation
Hybrid Encapsulation Method for Oled Devices
Application:
62/006,038 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 24, 2014
From: MORO, LORENZA; ZENG, XIANGHUI
To: SAMSUNG SDI CO., LTD.
Reel/Frame 033804/0370 →
Assignment of Assignor's Interest
Aug 31, 2015
From: MORO, LORENZA; ZENG, XIANGHUI
To: SAMSUNG SDI CO., LTD.
Reel/Frame 036457/0474 →
Confirmatory Assignment
May 5, 2016
From: MORO, LORENZA; BOESCH, DAMIEN; ZENG, XIANGHUI
To: SAMSUNG SDI CO., LTD.
Reel/Frame 038626/0507 →