IP Library Assignment 036457/0474
Patent Assignment
Reel/Frame 036457/0474

Assignment of Assignor's Interest

Recorded: 2015-08-31 Pages: 5
Assignors
MORO, LORENZA
Executed: 2014-08-22
ZENG, XIANGHUI
Executed: 2014-07-31
Assignee
SAMSUNG SDI CO., LTD.
150-20, GONGSE-RO, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, 17084, KOREA, REPUBLIC OF
Covered Property (1)
Direct/Laminate Hybrid Encapsulation and Method of Hybrid Encapsulation
Patent: 9,401,491 →
Application: 14/723,366 →
Publication: US 2015/0348803
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 31, 2015
From: BOESCH, DAMIEN
To: SAMSUNG SDI CO., LTD.
Reel/Frame 036457/0481 →
Confirmatory Assignment May 5, 2016
From: MORO, LORENZA; BOESCH, DAMIEN; ZENG, XIANGHUI
To: SAMSUNG SDI CO., LTD.
Reel/Frame 038626/0507 →