Patent Assignment
Reel/Frame 033806/0710
Assignment of Assignor's Interest
Recorded: 2014-09-24
Pages: 3
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method of Controlling Adherence of Microparticles to Substrate to Be Processed, and Processing Apparatus